
AE/LZB 119 1892 R1A OPERATING PROCEDURES
24
paging tone encoder is not required if the
appropriate feature licensed software option is
available at the console. The tone generation
circuits are also utilized during automated test
procedures performed at the factory.
Firmware
The operating program code for the microcontroller
circuits within the Enhanced Audio Enclosure is stored on a
factory-programmed 128K x 8-bit read-only memory
(ROM) chip located on the Audio System Board.
Occasionally, code stored on this chip may change as circuit
improvements occur and/or as new features are added to the
Enhanced Audio Enclosure. The chip is socketed which
allows simple removal if replacement is necessary. Refer to
the console’s Software Release Notes (SRN-1000-xx) for
specific details.
SPEAKERS KITS AND ASSEMBLIES
Speaker Kits used with the Enhanced Audio Enclosure
consist of mechanical hardware, one or more Speaker
Assemblies, and cables which interconnect each Speaker
Assembly to the Enhanced Audio Enclosure. For a given
enclosure, one Speaker Assembly is the "select speaker" and
the remaining are the "unselect speakers."
Speaker Kit mechanical hardware may be of several
different varieties providing either desktop speaker
operation in the form of a self-contained single-speaker case
or a rack-mount version in the form of a standard 19-inch
EIA rack mount assembly. Normally, rack-mount Speaker
Kits are factory equipped with two (2) Speaker
Assemblies—one select speaker and one unselect speaker. If
additional unselect speakers are required for a given
console, up to two additional Speaker Assemblies may be
added for a total of four (4) speakers in a 3-rack-unit-high
assembly.
NOTE
See the table and parts lists in LBI-39104 for
Speaker Kits' contents.
Each Speaker Assembly consists of a high-quality
magnetically-shielded speaker, a Speaker Amp Board which
accommodates audio power amplification circuitry, a front
panel, a panel-mounted volume control potentiometer, and
mechanical hardware. This unit may be installed in the
desktop case or in the rack-mount frame. Since a
magnetically-shielded speaker is employed, this assembly
may be located near a video display monitor without causing
monitor distortion. The difference between the select and
unselect Speaker Assemblies is front panel labeling.
The Speaker Amp Board is mounted just behind the
speaker on long metal stand-offs fastened to the assemblies
front panel. It amplifies low-power speaker audio signals
from the Enhanced Audio Enclosure and drives the speaker
with the amplified signal. It can drive the speaker with up to
five (5) watts of audio power. The interconnect cable
between the Enhanced Audio Enclosure and the Speaker
Assembly delivers both twelve-volt dc operating power and
the low-power speaker audio to the Speaker Amp Board.
OPERATING PROCEDURES
For complete operating procedures on the C3 Maestro
console for Windows NT, refer to Operator’s Manual
AE/LZT 123 1892.
INSTALLATION AND SET-UP
The Installation And Set-Up Manual included within
this manual set contains board-level configuration, cable
interconnection information and console application start-up
information. The manual also contains a detailed overview
of the advanced configurations possible for the console
including, including information on the feature licensed
options.
ADMINISTRATOR’S INFORMATION
System administration information for the C3 Maestro
console for Windows NT is available in a separately-
supplied manual. Administrator’s Manual
AE/LZB 119 1897 includes detailed information on the
console application such as program file names and
functions, the optional console GUI-related configurations
which are possible, and the Configuration Editor off-line
program. It also includes in-depth information on the
console’s feature licensed options and configuration
information on Windows NT-related settings which
influence how the console application operates. Typically,
knowledge of the information presented in the
Administrator’s Manual is only required by administrative
personnel in the CEC/IMC network system who are
responsible for the system’s dispatch consoles.
MAINTENANCE
Enhanced Audio Enclosure and Speaker Assembly
disassembly instructions follow. Refer to the appropriate
maintenance manual included with this manual set for
detailed board-level maintenance information. These
maintenance manuals contain board outline and schematic
NOTE
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